Speakers
Confirmed Presentations Include:
- Mufadal Ayubali, Entegris
Challenges in Filtration for Post CMP Cleaning Chemistries - Stephen Beaudoin and Ravi Jaiswal, Purdue University
Particle Adhesion to Photomask Substrates - Ahmed A. Busnaina, Northeastern University
Fundamentals and Wet and Dry Cleaning - Jerome Daviot, DuPont/EKC Technology
Post-copper CMP Cleaning Challenges Beyond 45 nm - Yehiel Gotkis, KLA – Tencor Corp and Lou Kondic, NJIT
To the Origin of the Watermarks formation. Liquid Film Curriculum Vitae: Physics and Chemistry of the Phenomena Occurring During Thin Liquid Film Drying on the Semiconductor Wafer Surfaces - Jianjun Hao, SACHEM
Enhanced Cleaning Chemistry for Particle Removal and Damagefree Cleans - Takeshi Hattori, Sony
Super Critical CO2 Cleaning of Silicon Surfaces – Challenges and Opportunities- - Frank Holsteyns, SEZ
Cleaning: Once Again, the Challenges Continues - Lukasz Hupka, University of Utah
Investigation of Interaction Forces between Contaminant Particle and the Wafer Surface in Post-CMP Cleaning - Simon Kirk, DuPont/EKC Technology
Characterization and Optimization of Single Wafer Equipment With Advanced Aqueous Formulations to Achieve Lower Cost of Ownership for Advanced Cu Interconnect Cleaning Processes - Hong Liang, Texas A&M University
Comparison of Interfacial Forces during Post-CMP Cleaning - Jingoo Park, Hanyang University
Pattern Damage Force; Its Measurement and Application for Next Generation Wafer Cleanings - Abbas Rastegar, Sematech
New Advances in EUV Mask Blank Cleaning - Rick Reidy, University of North Texas
Effects of Plasma Damage on Low-k Film Surface Properties and Moisture Adsorption - Rakesh K. Singh, Entegris
PVA Roller Brushes Post-CMP Cleaning and Tribological Performance Characterization Approaches - Kurt Wostyn, IMEC
Towards a quantitative understanding of physical particle removal technologies