Speakers and Presentations
Stephen Beaudoin, Purdue University
Laura Mauer, SSEC
Beyond Brush Scrubbing for Particle Removal
Rick Reidy, University of North Texas
Rakash Singh, Entegris
New developments in performance characterization of Post CMP Cleaning Consumables
Dongsik Kim, Postech University
Analysis of the laser shock cleaning process for nanoscale particle removal
Jingoo Park, Hanyang University
Effect of Additives on Post Ru CMP Cleaning and Dispersion Stability of Ru CMP Slurry
Taehoon Kim, Northeastern University
Nanoparticle Removal with Refined Wet Laser-induced Shockwave Cleaning
Abbas Rastegar, Sematech
Water diffusion in EUV LTEM substrates and MoSi multilayer coated blanks
Pegah Karimi, Northeastern University
Removal of Nanoparticles from Submicron Trenches
Hong Liang, Texas A&M University
Surfactant concentration and Post-CMP Cleaning
Norbert Koster, TNO Science and Industry
New options with plasma
Gerhard Liebel, PVA TEPLA AG
High quality surface cleaning and conditioning for semiconductor substrates using advanced microwave plasma source technology
Jack Kuo, Novellus Systems
Defect reduction through pressure differential minimization between load locks and chamber
Takashi Hattori, Sony
Stripping and Cleaning of High-Dose Ion Implanted Photoresists Using a Single-wafer, Single Chamber, Dry/Wet Hybrid System
Annie Xia, Entegris
Controlled DI water gasification system for advanced semiconductor cleaning processes
Dr. H. Sohn, Akrion Systems
Simultaneous Removal of Particles from Front and Backsides by A Single Wafer Backside Megasonic System