NSF Center
for Nano and Micro-
contamination Control

Egan Research Center

Northeastern University
360 Huntington Avenue
Boston, MA 02115

phone: 617.373.6012
fax: 617.373.3266


Tuesday, November 13, 2007

8:30-9:00am Registration and Breakfast
The Colonnade Hotel – Boston Ballroom
2nd Floor
9:00-9:15am Welcome – Ahmed Busnaina
William Lincoln Smith Professor and
Director, NSF Center for Nano and
Microcontamination Control, Northeastern
9:15-9:45am Yehiel Gotkis, KLA-Tencor Corp and
Lou Kondic, NJIT

To the Origin of the Watermarks formation.
Liquid Film Curriculum Vitae: Physics and
Chemistry of the Phenomena Occurring During
Thin Liquid Film Drying on the Semiconductor
Wafer Surfaces
9:45-10:15am Frank Holsteyns, SEZ
Cleaning: Once Again, the Challenges
10:15-10:45am Jingoo Park, Hanyang University
Pattern damage force; its measurement
and application for next generation wafer
10:45-11:05am Break
11:05-11:35am Abbas Rasteger, Sematech
New Advances in EUV Mask Blank Cleaning
11:35am-12:05pm Ahmed Busnaina, Northeastern University
Fundamentals and Wet and Dry Cleaning
12:05-1:05pm Lunch
1:05-1:35pm Kurt Wostyn, IMEC
Towards a quantitative understanding of physical particle removal technologies
1:35-2:05pm Stephen Beaudoin and Ravi Jaiswal, Purdue University
Particle Adhesion to Photomask Substrates
2:05-2:35pm Jerome Daviot, EKC/Dupont
Post-Copper CMP Cleaning Challenges Beyond 45 nm – A Novel Approach
2:35-2:55pm Break
2:55-4:00pm Panel Discussion
5:00-7:00pm Reception, Posters, and Exhibitions
Raytheon Amphitheater, 240 Egan Research Center, Northeastern University


Wednesday, November 14, 2007

8:30-9:00am Registration and Breakfast
Colonnade Hotel – Boston Ballroom – 2nd Floor
9:00-9:30am Myoungshik Kim, Dongbu HiTek Co., Ltd
The Effect of Design Rule on Metal Corrosion in CMOS Image Sensor
9:30-10:00am Takeshi Hattori, Sony
Super Critical CO2 Cleaning of Silicon Surfaces -Challenges and Opportunities-
10:00-10:30am Rick Reidy, University of North Texas
Effects of Plasma Damage on Low-k Film Surface Properties and Moisture Adsorption
10:30-10:50am Break
10:50-11:20am Jianjun Hao, SACHEM
Enhanced Cleaning Chemistry for Particle Removal and Damagefree Cleans
11:20-11:50am Rakesh K. Singh, Entegris
PVA Roller Brushes Post-CMP Cleaning and Tribological Performance Characterization Approaches
11:50am-12:20pm Hong Liang, Texas A&M University
Comparison of Interfacial Forces during Post-CMP Cleaning
12:20-1:20pm Lunch
1:20-1:50pm Lukasz Hupka, University of Utah
Investigation of Interaction Forces between Contaminant Particle and the Wafer Surface in Post-CMP Cleaning
1:50-2:20pm Simon Kirk, DuPont/EKC Technology
Characterization and Optimization of Single Wafer Equipment With Advanced Aqueous Formulations to Achieve Lower Cost of Ownership for Advanced Cu Interconnect Cleaning Processes
2:20-2:50pm Mufadal Ayubali, Entegris
Challenges in Filtration for Post CMP Cleaning Chemistries