Agenda
Tuesday, November 13, 2007
8:30-9:00am | Registration and Breakfast The Colonnade Hotel – Boston Ballroom 2nd Floor |
9:00-9:15am | Welcome – Ahmed Busnaina William Lincoln Smith Professor and Director, NSF Center for Nano and Microcontamination Control, Northeastern University |
9:15-9:45am | Yehiel Gotkis, KLA-Tencor Corp and Lou Kondic, NJIT To the Origin of the Watermarks formation. Liquid Film Curriculum Vitae: Physics and Chemistry of the Phenomena Occurring During Thin Liquid Film Drying on the Semiconductor Wafer Surfaces |
9:45-10:15am | Frank Holsteyns, SEZ Cleaning: Once Again, the Challenges Continues |
10:15-10:45am | Jingoo Park, Hanyang University Pattern damage force; its measurement and application for next generation wafer cleanings |
10:45-11:05am | Break |
11:05-11:35am | Abbas Rasteger, Sematech New Advances in EUV Mask Blank Cleaning |
11:35am-12:05pm | Ahmed Busnaina, Northeastern University Fundamentals and Wet and Dry Cleaning |
12:05-1:05pm | Lunch |
1:05-1:35pm | Kurt Wostyn, IMEC Towards a quantitative understanding of physical particle removal technologies |
1:35-2:05pm | Stephen Beaudoin and Ravi Jaiswal, Purdue University Particle Adhesion to Photomask Substrates |
2:05-2:35pm | Jerome Daviot, EKC/Dupont Post-Copper CMP Cleaning Challenges Beyond 45 nm – A Novel Approach |
2:35-2:55pm | Break |
2:55-4:00pm | Panel Discussion |
5:00-7:00pm | Reception, Posters, and Exhibitions Raytheon Amphitheater, 240 Egan Research Center, Northeastern University |
Wednesday, November 14, 2007
8:30-9:00am | Registration and Breakfast Colonnade Hotel – Boston Ballroom – 2nd Floor |
9:00-9:30am | Myoungshik Kim, Dongbu HiTek Co., Ltd The Effect of Design Rule on Metal Corrosion in CMOS Image Sensor |
9:30-10:00am | Takeshi Hattori, Sony Super Critical CO2 Cleaning of Silicon Surfaces -Challenges and Opportunities- |
10:00-10:30am | Rick Reidy, University of North Texas Effects of Plasma Damage on Low-k Film Surface Properties and Moisture Adsorption |
10:30-10:50am | Break |
10:50-11:20am | Jianjun Hao, SACHEM Enhanced Cleaning Chemistry for Particle Removal and Damagefree Cleans |
11:20-11:50am | Rakesh K. Singh, Entegris PVA Roller Brushes Post-CMP Cleaning and Tribological Performance Characterization Approaches |
11:50am-12:20pm | Hong Liang, Texas A&M University Comparison of Interfacial Forces during Post-CMP Cleaning |
12:20-1:20pm | Lunch |
1:20-1:50pm | Lukasz Hupka, University of Utah Investigation of Interaction Forces between Contaminant Particle and the Wafer Surface in Post-CMP Cleaning |
1:50-2:20pm | Simon Kirk, DuPont/EKC Technology Characterization and Optimization of Single Wafer Equipment With Advanced Aqueous Formulations to Achieve Lower Cost of Ownership for Advanced Cu Interconnect Cleaning Processes |
2:20-2:50pm | Mufadal Ayubali, Entegris Challenges in Filtration for Post CMP Cleaning Chemistries |