Research
Our Research is focused on the fundamentals of surface cleaning and preparation:
- Understanding of physical and chemical cleaning mechanisms using megasonics, brush and other techniques, including damage evaluation and mitigation
- CMP and Post-CMP applications
- Cleaning of EUV reticles
- Measurement of particle adhesion force
- Removal of nanoparticles
- Laser Shock Cleaning
- High Concentration Ozone cleaning
- Super Critical CO2 Cleaning
- Particle generation, transport and deposition:
- Particulate contamination in low pressure processes (LPCVD, Sputtering, ion implant, etc.)
- Contamination during wafer handling
Presentation Archive
MicroContamination Research Center Presentation 2007
IUCRC Characterization of Defects
IUCRC_Mechanics of CMP and Post-CMP
IUCRC Post-CMP Adhesion Removal
Proposal Archive
The Mechanics of CMP and Post-CMO Cleaning
Techniques for Finding and Characterizing Defects and Contaminants
Development of a MEMs Based Micro Gas Analysis System
Particle Adhesion and Removal for Post-CMP Applications
Nano and Microscale Particle Removal
Physical Cleaning of Submicron Trenches, a Modeling Study
The Transport of Contaminants in Thin Film Deposition Processes