Publications
The following publications resulted from research funded by NSF and the member companies during the time period 2002 to 2006.
1. Park, Jin Goo, Ryu, Ju-Suk, Lee, Sang Ho, Hong, Yi Koan, Kim, Tae-Gon and Busnaina, Ahmed, “Interfacial and Electro-kinetic Characterization of IPA Solutions Related to Semiconductor Wafer Drying”, Journal of the Electrochemical Society, Vol. 153, Issue 9, 2006, pp. G811-G814.
2. Busnaina, A., Bakhtari, K., Guldiken, G. and Park, J, “Experimental and Analytical Study of Submicron Particle Removal from deep trenches,” Journal of the Electrochemical Society, Vol. 153, Issue 9, 2006, pp. C603-C607.
3. Busnaina, A., Bakhtari, K., Guldiken, G., Makaram, P., and Park, J, “Nanoparticle Removal Using Acoustic Streaming,” Journal of the Electrochemical Society, Vol. 153, Issue 9, 2006, pp. G846-G850.
4. Busnaina, A. and Park, J., “The Removal of Particle in Post-CMP Applications,” 2nd PacRim Int’l Conf on Planarization CMP and its Application Technology, Seoul, Korea, November 17-19, 2005, pp. 73-78. (Invited)
5. Song J., Hong , Y., Kim, T., Kang, Y., Kim, I., Park, J. and Busnaina, A., “Effect of BTA on Particle Adhesion in Cu CMP,” Abstract # 795, 208th ECS Meeting, Los Angeles, CA, October 16-21, 2005.
6. Lee, S., Lee, S., Park, J., Busnaina, A., Lee, J., Kim, T., Zhang, G. and Eschbach, F., “Nanoscale Particles Removal on an Extreme Ultra-Violet Lithography (EUVL) Mask Layer,” Abstract # 754, 208th ECS Meeting, Los Angeles, CA, October 16-21, 2005.
7. Makaram, P., Lee, S.H, Kang, Y.J, Okutucu, T., Park, J.G., Busnaina, A., Jang, D., Kim, D.S., Lee, J.M., Kim, T.H., Zhang, G., Eschbach, F. And Ramamoorthy, A., “Investigation of Nanoparticle Removal and possible Substrate Damage for EUV Reticles using Laser Shock Cleaning and Acoustic Streaming,” Proceedings, Sematech Int’l, Mask Cleaning Workshop, San Jose, CA, October 2005.
8. Park, Jin-Goo, and Busnaina, Ahmed, “Cu Post-CMP Cleaning and the Effect of Additives,” Semiconductor International, August 1,2005. On-line.
9. Han, Ja-Hyung, Koo, Ja-Eung , Hong, Duk-Ho, Park, Byung-Lyul, Kim, Seong-Il , Cho, In-Soo, Eom, Dae-Hong , Park, Jin-Goo, and Busnaina, A., “Effects of Patterns on Corrosion in Cu CMP,” J. of Solid State Phenomena, Vols. 103-104, April 2005, pp. 369-372.
10. Hong, Yi-Koan, Han, Ja-Hyung , Lee, Jin-Hyung, Park, Jin-Goo, and Busnaina, A., “Adhesion and Removal of Alumina Slurry Particles on Wafer Surfaces in Cu CMP,” J. of Solid State Phenomena Vols. 103-104, April 2005., pp. 275-278.
11. Guldiken, O., Bakhtari, K., Busnaina, A., and Park, J., “Metrology and Removal of Nanoparticles from 500 micron Deep Trenches,” J. of Solid State Phenomena, Vol. 103-104, (2005), pp. 137-140.
12. Bakhtari, K., and Busnaina, A., “The Removal of Nanoparticles from Trenches, Wafers and Masks; the effect of Megasonic Frequency and Cleaning,” Proceedings, 2005 Surface Preparation and Cleaning Conference, Austin, TX , April 19-20, 2005.
13. Bakhtari, K., and Busnaina, A., “The Effect of Frequency on Nanoparticle Removal Using Acoustic Streaming (Megasonics),” Proceedings, AVS, ICMI’05, Santa Clara, CA, March 21-23, 2005.
14. Bakhtari, K. , Guldiken, R.O., Busnaina, A.A., and J.G. Park, “Experimental and Modeling Study of Submicron Particle Removal from Deep Trenches,” Proceeding, 10th Intl CMP MIC Conf., Fremont, CA, February 22-25, 2005, pp.244-247. Invited Paper.
15. Bakhtari, K., Guldiken, R.O., Makaram, P., Busnaina, A., and Park, J.G., “Nano-Scale Particle Removal Using High Frequency Acoustic Streaming,” Proceedings, 27th Annual Meeting of the Adhesion Society, Mobile, AL, February 13-16, 2005. pp. 404-406.
16. Bakhtari, K., Guldiken, R.O., Makaram, P., Busnaina, A., and Park, J.G., “Removal of Nano-Particles Using Pulsating Flow in Micro-Scale Trenches,” Proceedings, 27th Annual Meeting of the Adhesion Society, Mobile, AL, February 13-16, 2005. pp. 115-117.
17. Lee, Sang-Ho, Kang, Young-Jae, Park, Jin-Goo, Busnaina, A.A., Lee, Jong-Myung, Kim, Tae-Hoon, Zhang, Guojing, Eschbach, Florence, and Ramamoorthy, Arun, “Laser Shock Removal of Nanoparticles from Si Capping Layer of EUV Mask,” Japanese Journal of Applied Physics, Vol. 44, No. 7B, 2005, pp. 5560-64.
18. Lee, Sang-Ho, Hong, Yi-Koan, Song, Jae-Hoon, Park, Jin-Goo, Busnaina, A.A., Zhang, Guojing, Eschbach, Florence, and Ramamoorthy, Arun,“ Particle Adhesion and Removal on EUV Mask Layers During Wet Cleaning, ” Japanese Journal of Applied Physics, Vol. 44, No. 7B, 2005, pp. 5479-83.
19. Bernard, J. M., Guildkin, O., Busnaina, A., and Park, J., “Investigation of the Fast Removal of Nano and Submicron Silica and Silicon Nitride Particles,” Semiconductor Fabtech, 23rd Edition, 2004, pp. 77-79.
20. Hong, Yi-Koan, Eom, Dae-Hong, Lee, Sang-Ho, Kim, Tae-Gon, Park, Jin-Goo, and Busnaina, Ahmed A., “The Effect of Additives in Post Cu CMP Cleaning on Particle Adhesion and Removal,” J. of The Electrochemical Society, 151 (11) 2004. pp. G756-G761.
21. Eom,Dae-Hong, Lim, Geun-Bae, Park, Jin-Goo, and Busnaina, Ahmed A., “The Reaction of Ozone and H2O2 in Ammonium Hydroxide (NH4OH) Solutions and Their Reaction with Silicon Wafers,” Japanese Journal of Applied Physics, Vol. 43, No. 6A, 2004, pp. 3335-3339.
22. Park, J.G., Busnaina, A., “Overview of Post CMP Cleaning,” Proceedings, 2004 MRS Korea Conference, Incheon, Korea, November 5, 2004, (CD). (Invited)
23. Guldiken, O., Busnaina, A., Park, J., Zhang, G., and Eschbach, F., “Metrology and Removal of Nanoparticles from EUV Substrates,” Proceedings, 3rd Int’l EUVL Symposium, Miyazaki, Japan, November 1-4, 2004, (CD).
24. Lee, Sang-Ho, Kang, Young-Jae, Park, Jin-Goo, Busnaina, Ahmed, Lee, Jong-Myung, Kim, Tea-Hoon, Zhang, Guojing, Eschbach, Florence, and Ramamoorthy Arun, “Damage Free Laser Shock Cleaning of EUV mask blank with Si Capping Layer,” Proceedings, 3rd Int’l EUVL Symposium, Miyazaki, Japan, November 1-4, 2004, (CD).
25. Busnaina A. A, Guldiken, O., and Park J., “Metrology and Removal of Nanoparticles from 500 Micron Deep Trenches,” Proceedings, 7th Int’l Symposium on Ultra Clean Processing Of Silicon Surfaces, UCPSS 2004, Brussels, Belgium, September 19-22, 2004, (CD).
26. Hong Y., Han J. H., Park J.G., and Busnaina A.A., “Adhesion and Removal of Alumina Slurry Particles from Wafer Surfaces in Cu CMP,” Proceedings, 7th Int’l Symposium on Ultra Clean Processing Of Silicon Surfaces, UCPSS 2004, Brussels, Belgium, September 19-22, 2004, (CD).
27. Han J.H., Koo J.E., Hong D.H., Park B.L., Park J.G., and Busnaina A. A., “Effects of Device Patterns on Corrosion induced Cu Defects in Cu CMP,” Proceedings, Int’l Symposium on Ultra Clean Processing Of Silicon Surfaces, UCPSS 2004, Brussels, Belgium, September 19-22, 2004, (CD).
28. Busnaina, A., “Overcoming Barriers to Nanoscale Manufacturing,” Proceedings, Nano Korea 2004, Seoul, Korea, August 24-27, 2004, pp.769-778. (Invited)
29. Guldiken, O, Busnaina, A., and Park, J, “The Removal of Submicron Particles from 500 Micron Deep trenches,” Proceedings, Sematech Int’l Wafer Clean & Surface Prep Conf., Austin, TX , May 6-7, 2004, (CD).
30. Busnaina, A. and Park, J., “The Removal of Nanoparticles from Deep Trenches,” Proceedings, AVS 5th ICMI’04, (CD), March 1-3, 2004, in Santa Clara, CA, (CD).
31. Park, J.G. and Busnaina, A., “Effect of Slurry Chemistry on Electrochemical and Frictional Behavior in Cu CMP,” Proceedings, AVS 5th ICMI’04, Santa Clara, CA, March 1-3, 2004, (CD).
32. Bernard, J. M., Guildkin, O., Busnaina, A., and Park, J., “Investigation of the Fast Removal of Nano and Submicron Silica and Silicon Nitride Particles,” Proceedings, 27th Annual Meeting of the Adhesion Society, Wilmington, NC, February 15-18, 2004, (CD).
33. Hu, S., X. Xiong, X., Busnaina, A., and Park, J., “The Removal of Submicron Ceria Particles Using DI Water,” Proceedings, 27th Annual Meeting of the Adhesion Society, Wilmington, NC, February 15-18, 2004, (CD).
34. Eom,Dae-Hong, Lim, Geun-Bae, Park, Jin-Goo, and Busnaina, Ahmed A., “The Reaction of Ozone and H2O2 in Ammonium Hydroxide (NH4OH) Solutions and Their Reaction with Silicon Wafers,” Japanese Journal of Applied Physics, 2004.
35. Busnaina, A. and Park, J., “The Removal of Nanoparticles from Deep Trenches,” Proceedings, AVS 5th ICMI’04, (CD), March 1-3, 2004, in Santa Clara, CA.
36. Park, J.G. and Busnaina, A., “Effect of Slurry Chemistry on Electrochemical and Frictional Behavior in Cu CMP,” Proceedings, AVS 5th ICMI’04, (CD), March 1-3, 2004, in Santa Clara, CA.
37. Bernard, J. M., Guildkin, O., Busnaina, A., and Park, J., “Investigation of the Fast Removal of Nano and Submicron Silica and Silicon Nitride Particles,” Proceedings, 27th Annual Meeting of the Adhesion Society, (CD), Wilmington, NC, February 15-18, 2004.
38. Hu, S., X. Xiong, X., Busnaina, A., and Park, J., “The Removal of Submicron Ceria Particles Using DI Water,” Proceedings, 27th Annual Meeting of the Adhesion Society, (CD), Wilmington, NC, February 15-18, 2004.
39. Park, J.G., and Busnaina, A. A., “Adhesion and Removal of Silica and Alumina Slurry Particles During Cu CMP Process,” Proceedings, Abs# 803, 204th Meeting of the Electrochemical Society (ECS), Orlando, FL, October 12-October 16, 2003.
40. Busnaina, A. A., Xiong, X, and Park, J.G., “Particle Adhesion and Removal in the Semiconductor Industry,” Proceedings, 2003 STLE/ASME Int’l Joint Tribology Conf., Ponte Vedra Beach, FL, Oct. 26-29, 2003.
41. Busnaina, A. A., Park, J.G., Lee, M.J., and You, S.Y., “Substrate Damage-free Laser Shock Cleaning of Particles,” Proceedings, Abs# 785, 204th Meeting of ECS, Orlando, FL, October 12-October 16, 2003.
42. Park, J.G., Busnaina, A. A., Lee, M.J., and You, S.Y., “Damage Free and Dry Removal of Nano-size Inorganic and Organic Particles from EUV Mask Layers by Laser Induced Shockwaves,” Proceedings, 2nd International EUVL Symposium, Antwerp, (CD), Belgium, September 30 – October 2, 2003.
43. Busnaina, A. A., Park, J.G., Ramamoorthy, Arun, and Zhang, G., “Nanoscale Surface Cleaning of EUV Reticles,” Proceedings, 2nd International EUVL Symposium, (CD), Antwerp, Belgium, September 30 – October 2, 2003.
44. Busnaina, A. A., Park, J. G., Lee, J. M., S., Hu, and You, S. Y., “The Removal of Submicron Particles Using Laser Shock Cleaning,” Proceedings, SEMICON W Annual Meeting, San Francisco, CA, July 14, 2003. pp. 3361-375.
45. Lee, J.M., You, S. Y., Park, J.G., and Busnaina, A.A., “Laser Shock Cleaning for Particle Removal,” Semiconductor International, 7/1/2003.
46. Feng, Jiang-Wei, Busnaina, Ahmed A., Steel, Eric B., Small, John A., and Park, J.G., “Effect of Time and Humidity on the Adhesion Induced Deformation of PSL Particles on Silicon Wafers,” J of Adhesion, 2004 (in press).
47. Park, J.G., and Busnaina, A. A, “The Adhesion and Removal of Silica particles on Cu, TEOS, SiLK and TaN for Post-CMP Processes,” Proceedings, , AVS 4th Int’l Conf. on Microelectronics and Interfaces, Santa Clara, CA March 3-6, pp.169-170.
48. Park, J.G., Lee, J.M., Hu, S., and Busnaina, A. A, “Removal of Submicron Particle Using Laser Shock Cleaning,” Proceedings, AVS 4th Int’l Conf. on Microelectronics and Interfaces, Santa Clara, CA March 3-6, pp. 166-168.
49. Busnaina, A., Xugang, X., and Park, J., “The Adhesion-induced Deformation of Micro and Nanoscale Particles,” Proceedings, 26th Annual Meeting of the Adhesion Society, Myrtle Beach, SC February 23-26, 2003, pp.375-376.
50. Park, J. and Busnaina, A., “The Adhesion And Removal Of Silica Particles On Copper Substrates During Copper CMP,” Proceedings, 26th Annual Meeting of the Adhesion Society, Myrtle Beach, SC February 23-26, 2003, pp.538-540.
51. Lee, J.M., You, S.Y., Park, J.G. and Busnaina, A., “Laser Shock Removal Of Micro and Nanoscale Particles,” Proceedings, 26th Annual Meeting of the Adhesion Society, Myrtle Beach, SC February 23-26, 2003, pp.534-536.